1.TDP大功率頂部為散熱片及散熱風扇，且風扇轉速可由“PWM”信號調節(jié)，轉速初步推薦值為1500-9000PPM (根據(jù)仿真情況靈活調節(jié)散熱轉速區(qū)間）。    2.壓塊采用導熱性能良好的黃銅材料，有利于大功率芯片散熱降溫。

50 ohm matched probe contact
Spacing: > 0.3mm

1. Meet the requirements of simultaneous test of baseband chip superimposed antenna.
2. Meet the test requirements of 5g communication or microwave radar.

1. It can be used for automatic machine test.
2. The test frequency can reach above 70ghz.